NVIDIA Engineers to Unveil Revolutionary Advancements in Data Center Innovations at Hot Chips 2024
By Ted Hisokawa | Aug 23, 2024 14:53
Get ready for a game-changing event as NVIDIA engineers prepare to unveil cutting-edge advancements in data center innovations at Hot Chips 2024.
Hot Chips 2024 is gearing up to be a revolutionary event as NVIDIA engineers gear up to present groundbreaking innovations that promise to elevate data center performance and energy efficiency to new heights. The highly anticipated event, scheduled to take place from August 25-27 at Stanford University, will feature a series of talks by senior NVIDIA engineers, each poised to showcase the latest developments in the field.
NVIDIA Blackwell Platform: Transforming the Landscape of AI Applications
Central to NVIDIA’s presentations will be the spotlight on the NVIDIA Blackwell platform, a cutting-edge integration of multiple chips, systems, and NVIDIA CUDA software that is set to drive the next generation of AI applications. One of the highlights of the event will be the unveiling of the NVIDIA GB200 NVL72, a multi-node, liquid-cooled solution that can seamlessly connect 72 Blackwell GPUs and 36 Grace CPUs, setting a new industry benchmark in AI system design. The discussions will also delve into the NVLink interconnect technology, lauded for its high throughput and low-latency capabilities, essential for powering generative AI applications.
Liquid Cooling Advancements: Paving the Way for Energy-Efficient Data Centers
A significant portion of the conference will be dedicated to exploring the latest advancements in liquid cooling technologies. Ali Heydari, director of data center cooling and infrastructure at NVIDIA, will present innovative designs for hybrid-cooled data centers that seek to revolutionize existing air-cooled data centers by integrating liquid-cooling units. These designs not only offer a more efficient cooling solution but also help save space within data center facilities. Heydari and his team are at the forefront of collaboration with the U.S. Department of Energy on the COOLERCHIPS program, focused on developing advanced cooling technologies. Leveraging the NVIDIA Omniverse platform, they are creating digital twins to model energy consumption and cooling efficiency, paving the way for a more sustainable data center future.
AI-Driven Chip Design: Revolutionizing Semiconductor Design with AI
NVIDIA is at the forefront of leveraging AI to enhance semiconductor design processes. Mark Ren, director of design automation research at NVIDIA, will shed light on how AI models are revolutionizing design quality and productivity by automating complex and time-consuming tasks. These AI models include cutting-edge prediction and optimization tools that enable engineers to analyze and enhance designs rapidly. Ren will delve into the development of AI agents powered by large language models (LLMs) that autonomously complete tasks, interact with designers, and learn from a database of human and agent experiences. He will provide tangible examples of AI applications in various aspects of semiconductor design, highlighting the transformative power of AI in accelerating innovation in this space.
These presentations underscore NVIDIA’s unwavering commitment to pushing the boundaries of data center computing through innovative technologies in AI and cooling solutions. With a relentless focus on delivering unparalleled performance, efficiency, and optimization across diverse industry sectors, NVIDIA is poised to revolutionize the future of data center computing.
Image source: Shutterstock